Optical measurement solution for SMD termination dipping

After a successful pilot installation last year, this March we have delivered several systems for optical in-line measurement of termination paste application, for TCP dipping machines.

The system is designed for integration inside the dipping machine, and performs precise measurements of components on the TCP after the dip process – checking the height of applied paste. Measurement data is collected for better process monitoring and control or to immediately alarm operations in case of significant process deviations. System can be configured with one or several cameras / measurement points on the dip-head. Achieved measurement accuracy is under 5 micrometers, and standard system optics support chip sizes from 0402 to 2220.

System setup on format change-over is fully automatic, with two motor axes for automated camera repositioning and focusing.